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FMM5715X
60GHz Power Amplifier
FEATURES *High Output Power; P1dB = 16 dBm (Typ.) @ f = 60 GHz *High Linear Gain: |S21| = 17 dB(Typ) @ f = 60 GHz *Wide Frequency Band : 57 - 64 GHz *Impedance Matched Zin/Zout = 50 DESCRIPTION The FMM5715X is a power amplifier MMIC designed for applications in the 57-64 GHz frequency range. This product is well suited for wireless LAN and point-to-point radio. Eudyna's stringent Quality Assurance Program assures the highest reliability and consistent performance.
Device photo
ABSOLUTE MAXIMUM RATING (Case Temperature Tc=25 C) Item Symbol Rating
DC Input Voltage DC Input Voltage Input Power Storage Temperature VDD VGG Pin Tstg +4 -3 3 -55 to +125
o
o
Unit
V V dBm o C
RECOMMENDED OPERATING CONDITION (Case Temperature Tc=25 C) Item Symbol Condition
DC Input Voltage Backside Temperature VDD TB 3 -45 to +85
o
Unit
o
V C
ELECTRICAL CHARACTERISTICS (Case Temperature Tc=25 C) Limit Item Symbol Condition Min. Typ. Max.
Output Power at 1dB G.C.P. Linear Gain Total Drain Current Input Return Loss Output Return Loss P1dB |S21| IDDt |S11| |S22| V DD=3V V GG=0V f = 57~64 GHz 12 14 16 18 150 8 8 -
Unit
dBm dB mA dB dB
These values are representative for CW on chip measurements that are made without bonding wires at the RF ports.
ESD
Class 0
~ 199V
Note : Based on EIAJ ED-4701 C-111A(C=100pF, R=1.5k)
Edition 2.1 Dec. 2005
1
FMM5715X
60GHz Power Amplifier MMIC
Output Power vs. Input Power Bias Conditions: VDD = 3V, VGG = 0 V
18 16 Output Power (dBm) 14 12 10 8 6 4 -14 f=60GHz f=64GHz 14 Pout (dBm) 12 10 8 6 4 -12 -10 -8 -6 -4 -2 0 2 4 54 56 58 60 62 64 Input Power (dBm) Freq (GHz) f=57GHz 18 16
Pin = 2 dBm
Output Power vs. Frequency Bias Conditions: VDD = 3V, VGG = 0 V
P1dB
Pin = 0 dBm Pin = -2 dBm Pin = -4 dBm Pin = -6 dBm Pin = -8 dBm Pin= -10 dBm
66
68
Typical on chip measurements 2
FMM5715X
60GHz Power Amplifier
Linear Gain vs. Frequency Bias Conditions: VDD = 3V, VGG = 0, -0.1, -0.2 V
20 18 16 14 |S 2 1 | (d B ) 12 10 8 6 4 2 0 50 55 60 Frequency (GHz) 65 70
VGG = -0.1 V, IDD = 130 mA VGG = -0.2 V, IDD = 100 mA VGG = 0 V, IDD = 150 mA
Input Return Loss vs. Frequency Bias Conditions: VDD = 3V, VGG = 0, -0.1, -0.2 V
0 -5 -10 -15
VGG = -0.1 V, IDD = 130 mA
Output Return Loss vs. Frequency Bias Conditions: VDD = 3V, VGG = 0, -0.1, -0.2 V
0
VGG = -0.1 V, IDD = 130 mA
VGG = 0 V, IDD = 150 mA
-5 |S 2 2 | (d B ) -10 -15 -20 -25
|S 1 1 | (d B )
VGG = -0.2 V, IDD = 100 mA
-20 -25 50
VGG = -0.2 V, IDD = 100 mA
VGG = 0 V, IDD = 150 mA
55
60 Frequency (GHz)
65
70
50
55
60 Frequency (GHz)
65
70
Typical on chip measurements 3
FMM5715X
60GHz Power Amplifier MMIC
S-PARAMETERS VDD = 3V, VGG = 0V, IDD = 150 mA
30 20
|S 1 1 |, |S 2 2 | (d B )
0
S11
-5
S22
10 |S 2 1 | (d B ) 0 -10 -20 -30 -40 0 20 40 60 80 100 Frequency (GHz)
-10 -15 -20 -25 0 20 40 60 80 100 Frequency (GHz)
Typical on chip measurements 4
FMM5715X
60GHz Power Amplifier
S-PARAMETERS VDD = 3V, VGG = 0V, IDD= 150 mA
Freq. GHz 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 S11 MAG 0.621 0.594 0.557 0.523 0.496 0.472 0.451 0.436 0.425 0.419 0.416 0.415 0.416 0.420 0.426 0.431 0.439 0.449 0.457 0.465 0.477 0.488 0.501 0.513 0.525 0.541 0.551 0.565 0.578 0.599 0.615 0.636 0.655 0.671 0.693 0.708 0.723 0.733 0.752 0.764 0.775 0.782 0.788 0.787 0.785 0.776 0.759 0.730 0.680 0.620 S21 MAG 0.017 0.031 0.075 0.170 0.290 0.237 0.153 0.110 0.086 0.071 0.056 0.056 0.074 0.063 0.048 0.030 0.026 0.044 0.135 0.254 0.424 0.668 0.995 1.341 1.607 1.713 1.633 1.530 1.431 1.355 1.284 1.241 1.223 1.221 1.249 1.277 1.349 1.432 1.544 1.702 1.878 2.114 2.388 2.779 3.178 3.717 4.379 5.101 5.891 6.554 S12 MAG 0.00014 0.00010 0.00029 0.00060 0.00072 0.00037 0.00018 0.00012 0.00007 0.00017 0.00015 0.00035 0.00032 0.00026 0.00017 0.00059 0.00032 0.00101 0.00121 0.00060 0.00019 0.00028 0.00055 0.00103 0.00193 0.00154 0.00174 0.00157 0.00233 0.00132 0.00094 0.00089 0.00098 0.00110 0.00084 0.00137 0.00151 0.00222 0.00159 0.00181 0.00218 0.00182 0.00176 0.00248 0.00156 0.00149 0.00133 0.00158 0.00239 0.00188 S22 MAG 0.997 0.994 0.952 0.851 0.867 0.884 0.913 0.930 0.939 0.944 0.938 0.904 0.916 0.938 0.945 0.943 0.934 0.913 0.909 0.881 0.834 0.765 0.664 0.540 0.424 0.355 0.340 0.321 0.304 0.291 0.279 0.268 0.264 0.266 0.269 0.274 0.282 0.294 0.301 0.313 0.321 0.327 0.331 0.337 0.341 0.340 0.333 0.321 0.299 0.275 Freq. ANG GHz -11.7 51 -23.8 52 -37.4 53 -43.9 54 -50.7 55 -57.2 56 -65.9 57 -74.8 58 -83.6 59 -92.3 60 -101.0 61 -108.5 62 -113.1 63 -120.7 64 -128.4 65 -136.1 66 -144.1 67 -151.4 68 -159.4 69 -168.6 70 -178.2 71 171.7 72 162.6 73 155.6 74 154.7 75 160.3 76 165.3 77 166.5 78 168.0 79 170.1 80 172.7 81 174.8 82 177.4 83 -179.6 84 -178.2 85 -177.0 86 -176.1 87 -176.7 88 -177.0 89 -178.1 90 179.6 91 177.2 92 174.1 93 170.8 94 166.8 95 162.1 96 155.8 97 148.7 98 142.1 99 134.2 100 S11 MAG 0.539 0.474 0.406 0.360 0.327 0.306 0.280 0.272 0.260 0.250 0.238 0.258 0.319 0.417 0.529 0.608 0.662 0.678 0.685 0.672 0.652 0.644 0.628 0.619 0.609 0.605 0.611 0.608 0.600 0.602 0.599 0.594 0.592 0.591 0.596 0.592 0.594 0.588 0.591 0.584 0.593 0.584 0.586 0.583 0.582 0.584 0.582 0.589 0.587 0.595 S21 MAG 7.091 7.366 7.559 7.621 7.686 7.781 7.841 7.938 8.046 8.118 8.218 8.207 8.059 7.527 6.591 5.437 4.272 3.252 2.512 1.962 1.543 1.209 1.007 0.827 0.675 0.562 0.497 0.420 0.367 0.328 0.288 0.262 0.233 0.214 0.179 0.180 0.174 0.157 0.149 0.139 0.133 0.123 0.125 0.113 0.115 0.104 0.091 0.078 0.082 0.057 S12 MAG 0.00306 0.00443 0.00442 0.00520 0.00858 0.00716 0.00672 0.00558 0.00725 0.00711 0.00784 0.00681 0.00671 0.00818 0.00671 0.00734 0.00429 0.00629 0.00633 0.00578 0.00716 0.00683 0.00710 0.00660 0.00819 0.00823 0.00701 0.01034 0.00994 0.00836 0.00812 0.00798 0.00873 0.01010 0.00993 0.00722 0.00510 0.00493 0.00488 0.00399 0.00317 0.00200 0.00256 0.00254 0.00210 0.00369 0.00491 0.00359 0.00488 0.00667 S22 MAG 0.239 0.203 0.170 0.140 0.114 0.092 0.076 0.087 0.114 0.156 0.214 0.282 0.377 0.475 0.562 0.608 0.643 0.651 0.647 0.652 0.652 0.656 0.659 0.663 0.658 0.665 0.667 0.663 0.673 0.674 0.675 0.676 0.680 0.683 0.679 0.683 0.688 0.697 0.699 0.703 0.714 0.712 0.721 0.735 0.737 0.743 0.739 0.731 0.715 0.717
ANG -14.4 -27.8 -39.5 -49.5 -57.9 -65.8 -72.3 -77.8 -82.9 -87.5 -91.7 -95.6 -99.0 -102.4 -105.7 -108.9 -111.8 -115.0 -118.3 -120.9 -123.9 -126.5 -129.5 -132.1 -135.2 -137.9 -141.2 -144.1 -146.8 -150.1 -153.4 -157.1 -160.8 -165.2 -169.3 -173.5 -178.4 176.6 171.3 165.7 159.6 153.3 146.0 138.6 130.4 121.7 110.9 99.9 87.9 75.0
ANG -120.8 163.7 95.4 10.6 -71.5 -153.2 164.6 139.6 122.5 109.1 101.6 112.7 90.6 70.8 59.9 63.3 110.9 150.1 142.7 122.9 99.8 73.6 42.7 8.8 -27.4 -62.7 -93.4 -118.8 -141.8 -161.5 -179.5 164.4 148.5 133.4 118.5 105.4 91.1 77.2 63.4 49.2 34.0 19.3 3.2 -14.0 -32.0 -50.8 -71.9 -93.8 -118.2 -143.2
ANG -72.6 99.9 65.9 -7.4 -95.9 -155.0 155.9 118.3 -41.9 -169.4 -161.2 177.6 36.7 8.6 -4.8 -101.0 -106.7 -142.6 147.0 93.4 167.5 -175.4 -99.4 -157.2 168.1 159.5 149.5 115.7 105.5 94.0 64.0 83.0 118.6 117.8 100.7 97.6 101.2 84.0 75.6 85.4 51.3 70.5 47.2 60.8 37.4 38.9 123.7 65.1 89.0 97.9
ANG 63.0 51.1 40.2 29.1 17.3 3.3 -11.1 -26.2 -41.3 -52.8 -58.3 -59.3 -62.2 -70.1 -82.9 -99.0 -114.1 -127.9 -139.7 -149.3 -158.2 -165.6 -171.6 -177.6 177.7 172.2 167.2 161.8 156.2 150.6 145.5 139.6 134.8 129.0 122.6 116.9 110.4 103.9 97.1 90.6 82.6 75.9 68.4 59.6 53.5 45.5 37.5 30.9 23.4 15.9
ANG -170.0 164.1 138.8 113.2 89.6 64.9 41.7 17.2 -7.1 -32.4 -59.3 -86.5 -117.0 -148.2 -179.3 150.7 122.6 98.8 77.2 58.0 39.8 23.7 7.4 -8.1 -21.7 -34.4 -47.0 -60.0 -72.4 -84.8 -96.8 -112.8 -123.3 -136.8 -147.9 -162.7 -175.5 168.8 154.2 137.5 123.7 108.4 91.0 72.3 52.9 27.2 13.9 -13.9 -34.7 -63.6
ANG 86.8 77.6 66.8 48.4 35.4 3.4 -5.2 -17.1 -22.4 -57.6 -84.1 -108.3 -137.5 -168.1 149.7 112.2 98.2 70.4 70.3 61.1 52.8 33.0 25.4 20.9 19.7 14.0 -4.7 -3.8 -20.5 -20.5 -35.3 -44.6 -59.2 -62.9 -79.3 -97.1 -117.5 -104.3 -92.7 -97.3 -136.6 -111.8 -104.6 14.5 -8.0 -8.0 -9.6 -27.7 -22.7 -38.3
ANG 126.3 119.0 112.6 104.9 94.2 73.9 47.1 14.3 -12.7 -29.2 -39.9 -49.9 -60.3 -73.7 -87.0 -100.5 -111.5 -120.4 -127.7 -133.5 -138.5 -143.0 -147.5 -151.0 -154.5 -158.0 -160.9 -163.9 -166.8 -169.3 -172.2 -174.6 -177.4 -179.3 178.1 176.0 174.2 172.0 169.4 167.0 164.4 162.3 159.8 157.6 154.5 151.1 147.0 144.9 142.2 141.6
Typical on chip measurements
5
FMM5715X
60GHz Power Amplifier MMIC
CHIP OUTLINE VDD1 VDD2 VDD3
RFin
RFout
VGG1
VGG2
VGG3
Bonding Pad Locations (Dimension in Micron Meters) 490 1105 1860
800
460
120 0 0 80 540 1010 1305 2110 Unit; m Chip size; 2190 x 920 m Chip Thickness; 70 m
Pad Dimensions DC Pads; 80 x 80 m RF Pads; 80 x 60 m 6
FMM5715X
60GHz Power Amplifier MMIC
Assembly Diagrams Recommendation assembly Single Layer Capacitor 100 pF To DC Power Supply (VDD)
RF In
*1
*1
RF Out
Z0 = 50
Z0 = 50
*2
*1; RF Wire Length = 150 m *2; DC Wire Length 1000 m
DC Power Supply for a Custom Application
To DC Power Supply (VDD)
Single Layer Capacitor 100 pF *2 RF In *1 Z0 = 50 *2 Single Layer Capacitors 100 pF *1 Z0 = 50 RF Out
VGG1 (AMP)
VGG2(AMP)
VGG3(AMP)
7
FMM5715X
60GHz Power Amplifier MMIC
MTTF vs. Backside Temperature
1.E+12 1.E+11 Ea=1.02eV 1.E+10 MTTF (hrs) 1.E+09 1.E+08 1.E+07 1.E+06 1.E+05 20 40 60 80 100 120 140 160 180 BacksideTemperature (degC)
8
FMM5715X
60GHz Power Amplifier MMIC
DIE ATTACH 1) The die-attach station must have accurate temperature control, and an inert forming gas should be used. 2)Chips should be kept at room temperature except during die-attach. 3) Place package or carrier on the heated stage. 4) Lightly grasp the chip edges by the longer side using tweezers. Die attach conditions Stage Temperature : 300 to 310 deg.C Time : less than 15 seconds AuSn Perform Volume : per next Figure
500 Volume of Au-Sn Perform (10 -3/mm 3)
400
300
FMM5715X
200
100
0 0 1 2 3 4 5 Area of Chip Back Surface (mm^2)
WIRE BONDING The bonding equipment must be properly grounded. The following or equivalent equipment, tools, materials, and conditions are recommended. 1) Bonding Equipment and Bonding Tool. Bonding Equipment : West Bond Model 7400 (Manual Bonder) Bonding Tool : CCOD-1/16-S-437-60-F-2010-MP (Deweyl) 2) Bonding Wire Material : Hard or Half hard gold Diameter : 0.7 to 1.0 mil 3) Bonding Conditions Method : Thermal Compression Bonding with Ultrasonic Power Tool Force : 0.196 N +/- 0.0196 N Stage Temperature : 215 deg.C +/- 5 deg.C Tool Heater : None Ultrasonic Power Transmitter : West Bond Model 1400 Duration : 150 mS/Bond
9
FMM5715X
60GHz Power Amplifier MMIC
Eudyna Devices USA Inc. 2355 Zanker Rd. San Jose, CA 95131-1138, U.S.A. TEL: (408) 232-9500 FAX: (408) 428-9111 www.us.eudyna.com Eudyna Devices Europe Ltd. Network House Norreys Drive Maidenhead, Berkshire SL6 4FJ United Kingdom TEL: +44 (0) 1628 504800 FAX: +44 (0) 1628 504888 Eudyna Devices Asia Pte. Ltd. Hong Kong Branch Suite 1906B, Tower 6, China Hong Kong City 33 Canton Road, Tsimshatsui, Kowloon Hong Kong TEL: +852-2377-0227 FAX: +852-2377-3921 Eudyna Devices Inc.
Sales Division
CAUTION
Eudyna Devices Inc. products contain gallium arsenide (GaAs) which can be hazardous to the human body and the environment. For safety, observe the following procedures: *Do not put these products into the mouth. *Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical processing as these byproducts are dangerous to the human body if inhaled, ingested, or swallowed. *Observe government laws and company regulations when discarding this product. This product must be discarded in accordance with methods specified by applicable hazardous waste procedures. Eudyna Devices Inc. reserves the right to change products and specifications without notice.The information does not convey any license under rights of Eudyna Devices Inc. or others.
(c) 2005 Eudyna Devices USA Inc. Printed in U.S.A.
1, Kanai-cho, Sakae-ku Yokohama, 244-0845, Japan TEL +81-45-853-8156 FAX +81-45-853-8170
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